DIP Battery Contacts | Through-Hole Mount (THM) Terminals

Engineering Overview DIP (Through-Hole Mount) battery contacts provide rigid PCB anchoring for coin cell and cylindrical power architectures. Stamped from high-modulus substrates—including Phosphor Bronze, Beryllium Copper, and Stainless Steel—these terminals maintain strict deflection memory and sustained contact force across thousands of insertion cycles.

Mechanical & Soldering Advantages Unlike surface-mount (SMT) variants, THM contacts transfer mechanical stress directly through the PCB board. This architecture eliminates solder pad delamination risks under severe shock, vibration, or aggressive battery replacement. Finished with precision Nickel, Tin, or Gold plating, the contacts actively resist electrolyte corrosion and optimize wave soldering yield for automated assembly lines.

Application Matrix These components are specified for hardware requiring absolute power continuity, including handheld medical instrumentation, industrial IoT sensor modules, RF transmitters, and ruggedized portable electronics.

Engineering Protocol To ensure 1:1 precision replacement for Keystone or MPD equivalents, deployment of our Senior NPI Engineering Team is required. Please review the [Technical Datasheets] and [2D Footprint Specs] to verify layout parameters.

Request Engineering Support. We will provide matching PDF drawings within our strict 12-hour fast response SLA.